Technical Features
High-fidelity and high-efficiency replication for diffractive optical waveguides, microlens arrays, etc. Support double-sided alignment imprinting.
Functional Parameters
- Imprint Area: Max. 12 inches
- Substrate Size: 8-inch / 12-inch glass wafer / silicon wafer with notch; compatible with 4-inch / 6-inch silicon wafers
- Imprint Mode: Roll-to-flat imprint; planar-to-planar imprint (optional)
- Gluing Method: Spin coating; dispense coating (optional)
- Imprint Uniformity: Better than ±5%
- Residual Layer:
- Imprint structure: 50 nm–2 μm, residual layer < 20 nm
- Imprint structure: 5 μm–100 μm, residual layer thickness precisely controllable
- Alignment Imprint: 6-axis precision stage, alignment accuracy ±5 μm
- Curing Light Source: 1000 mW/cm? @ 365 nm (LED area light source)
- Imprint Platform:
- Support platform heating and active cooling
- Heating up to 100 °C with uniformity ±3%
- Equipped with active cooling system and micro-porous wafer vacuum adsorption
- Cleanliness Level: Class 10(external environment Class 100)
- Environmental Requirements: Ambient temperature 15–25 °C, humidity ≤ 70%
*SVG reserves the right of final interpretation of all information